and BGA/SMD component replacement.
Use tools such as hot air rework stations, microscopes, multimeters, and thermal cameras.
Read board schematics (ZXW, Wuxinji, etc.) and perform board-level troubleshooting.
Maintain repair quality standards and turnaround times.
Record repairs and test results using internal systems.
Candidate Profile
Minimum
2 years of proven experience
in motherboard-level smartphone repair.
Expert in
microsoldering
and reballing techniques.
Ability to troubleshoot short circuits and power issues using schematics and tools.
Self-motivated, detail-oriented, and reliable.
English proficiency required
; Arabic is a plus.
Preferred Qualifications
Technical diploma or degree in electronics/electrical engineering or equivalent.
Certifications in board-level repair or microsoldering are a strong advantage.
Salary & Benefits
Competitive salary based on experience Basic Salary Plus Comission
Monthly performance bonuses.
Accommodation support (or allowance).
How to Apply
Send your
CV and sample sales & repair portfolio
(if available) by Indeed.
Job Type: Full-time
Pay: BASIC SALARY PLUS COMISSION
Job Type: Full-time
Pay: AED1,000.00 - AED3,000.00 per month
Application Deadline: 31/07/2025
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